Chinese semiconductor equipment manufacturer ACM Research (Shanghai) Inc. announced an order backlog exceeding 17.07 billion yuan ($2.43 billion) as of late September, marking an 88.2 percent year-over-year surge propelled by accelerating domestic tool localization and surging global demand for artificial intelligence infrastructure.
In a regulatory filing released late Sept. 30, the Shanghai-listed technology giant confirmed that its order book expanded substantially compared to voluntary disclosures during the same period last year. The company’s total market capitalization stood above 140 billion yuan ($20 billion) following the close of trading on Sept. 30.
ACM Research Shanghai specializes in critical wafer fabrication and advanced packaging manufacturing equipment, including wet cleaning systems, electroplating tools, vertical furnace lines, coater-developer tracks, plasma-enhanced chemical vapor deposition (PECVD) systems, and stress-free polishing tools. The company has continuously broadened its platform strategy to supply both front-end wafer fabs and panel-level advanced packaging facilities.
For the first half of 2026, the equipment manufacturer reported revenue of 3.72 billion yuan, representing a 13.87 percent year-over-year increase, while net profit attributable to the parent company jumped 42.14 percent to 989 million yuan. Full-year revenue for 2026 is projected to reach between 8.2 billion yuan and 8.8 billion yuan.
Company officials attributed the top-line expansion to a dual wave of domestic tool replacement across Chinese semiconductor fabs and expanding global wafer capacity driven by high-performance computing requirements. Accelerated equipment delivery, installation, and customer acceptance testing further supported revenue recognition throughout the period.
The net profit growth was additionally supported by fair value gains and investment income from external holdings alongside a reduction in share-based compensation expenses. As global AI computing workloads continue to drive capital expenditure across semiconductor supply chains, the company remains positioned to capture further market share across domestic chipmaking and advanced packaging operations.
